高雄應用科技大學 化學工程與材料工程系
Department of
Chemical and Materials Engineering
何宗漢 教授 (Dr. Tsung-Han Ho)
兼任系主任
高分子材料實驗室(Polymeric Materials Lab )
個人簡介
學歷
國立成功大學化工系博士
經歷
台灣玻璃公司溶解控制室領班2年
專長
電子用高分子材料
高分子合成與物性
半導體封裝材料
難燃高分子材料
E-mail
thho@cc.kuas.edu.tw
實驗室簡介
辦公室:化材館7樓701
(電話:07-3814526分機:5100)
實驗室:化材館6樓603
(電話:07-3814526分機:5144轉603)
何宗漢教授 論文及著述目錄
(A) 期刊論文
1.
Chung-Wen Kuo, Jeng-Kuei Chang, Yuan-Chung
Lin, Tzi-Yi Wu, Po-Ying Lee and Tsung-Han
Ho, 2017, “Poly(tris(4-carbazoyl-9-ylphenyl)amine)/Three Poly(3,4-ethylene-
dioxythiophene) Derivatives in Complementary
High-Contrast Electrochromic Devices”, Polymers, 9,
543.
2.
Yu-chan Chao, Tsung-han Ho,
Zhi-jiao Cheng, Li-heng
Kao, and Ping-szu Tsai, 2017, “A Study on
Combining Natural Dyes and Environmentally-friendly Mordant to Improve Color
Strength and Ultraviolet Protection of Textiles”, Fibers and Polymers, Vol.18, No.8,
1523-1530.
3.
Ming-Dar
Fang, Tsung-Han Ho, Jui-Pin
Yen, Yu-Run Lin, Jin-Long Hong, 2015, “Preparation of Advanced Carbon Anode
Materials from Mesocarbon Microbeads
for Use in High C-Rate Lithium Ion Batteries”, Materials, Sci., 8, 3550-3561.
4.
Yuchan CHAO, Jinluh
CHEN, Weinduo YANG, Tsunghan
HO, Fusan YEN, 2015, “Exposure Hazard to Bisphenol
A for Labor and Particle Size Distribution at Polycarbonate Molding Plants”,
Iran J Public Health. Sci., 6, 783-790.
5.
Chialing Chang, Tsung-Han
Ho and Te-Hua Fang, 2015, “Topographical and tribological characteristics of Asian human hair cuticles”,
Mathematical Problems in Engineering. Sci., Vol.2015, Article ID 985393, 1-5.
6.
Ming-Dar Fang,
Jiin Jiang Jow, Yu Heng Yeh, Ho Rei
Che, Mao Sung Wu, Chung Wen Kuo,
Tzong Rong Ling, Tsung Han Ho, 2014, “Improving the sintering
behavior of mesocarbon-microbeads for the manufacture
of high quality carbon products using a joint promoter comprising carbon black
and glycidyl methacrylate”, Materials Chemistry and
Physics. Sci., Vol.149, 150, 400~404.
7.
吳文傑、方明達、鄭錫勳、劉旭唐、何宗漢*, 2014, “以填口方法在不同的拋光參數下取得最佳玻璃移除率研究”, 工程科技與教育學刊, 2(11),
252-263.
8.
Tzong-Liu Wang,
Yao-Yuan Chuang, Yeong-Tarng Shieh,
Chien-HsinYang, Chin-Hsiang Chen, Tsung-HanHo,
2014, “Intramolecular
Donor–Acceptor Copolymers Containing Side-Chain-Tethered Perylenebis(dicarboximide) Moieties for Panchromatic Solar Cells”, J. Polym. Sci. Part A: Polym. Chem., 52, 1978–1988.
9.
Tzong-Liu Wang, Yeong-Tarng Shieh, Chien-Hsin Yang, Ya-Chun Chen, Tsung-Han Ho, Chin-Hsiang Chen, 2013, “A new low band gap donor–acceptor alternating copolymer
containing dithienothiophene and fluorenone
unit”, J Polym Res, (2013) 20:213
10. Chung-Wen Kuo, Chao-Wen Huang, Bor-Kuan Chen, Wen-Bin Li, Pin-Rong
Chen, Tsung-Han Ho, Ching-Guey
Tseng, Tzi-Yi Wu, 2013, “Enhanced Ionic Conductivity in
PAN–PEGME-LiClO4-PC Composite Polymer Electrolytes”, Int. J. Electrochem.
Sci., 8, 3834–3850.
11. Wu, Yi-Jhen; Ho, Ko-Shan; Cheng, Yu-Wei;
Chao, Liang; Wang, Yen-Zen; Hsieh, Tar-Hwa; Ho, Tsung-Han;
Han, Yu-Kai, 2013, “Studies on the
synthesis of low molecular weight, one-dimensional polyanilines
prepared by fast emulsion polymerization using DBSA/HCl
emulsifiers”, Polymer International, 62,
581–590.
12. 蔡佳星、
13. T. L. Wang, Y. T. Shieh, C. H. Yang, T. H. Ho, C. H. Chen, 2013, "Photovoltaic properties and annealing
effects of a low bandgap copolymer containing dithienothiophene and benzothiadiazole
units", eXPRESS Polymer Letters, Vol.7, No.1, 63–75.
14. Tzong-Liu Wang, Chien-HsinYang, Yeong-Tarng Shieh, Ya-Chun Chen, Tsung-HanHo, Chin-Hsiang Chen, 2012, “An extremely low band gap donor-acceptor copolymer for
panchromatic solar cells,” Solar Energy Materials & Solar cells, 107(2012),
298-306 (IF= 4.593).
15. 邱建勳、何宗漢、
16. Rong-Hsien Lin, Wei-Ming Wang, Yi-Hung Chen, Tsung-Han Ho, 2012, “Preparation and Characterization of Biodegradable Condensation
Polyimide”, Polymer Degradation
and Stability, 97, 1534-1544. Impact Factor 2.59
17. Yuan-Chung
Lin, Shou-Heng Liu, Han-Ren
Hyu, and Tsung-Han Ho,
2012, “Synthesis, Characterization and Photocatalytic
Performance of Self-assembled Mesoporous TiO2
Nanoparticles”, Spectrochimica Acta
Part A-Molecular and Biomolecular Spectroscopy, 95,
300-304 (SCI IF: 1.77)
18. 何宗漢、楊森智、
19. T. L. Wang, C. H. Yang, Y. T. Shieh,
A. C. Yeh, C. H. Chen, T. H. Ho, 2012, “Effects of annealing on the
polymer solar cells based on CdSe–PVK electron
acceptor”, Materials Chemistry and Physics, 132, 131–137.
20. 李科諒、
21. T. L. Wang, A. C. Yeh, C. H. Yang, Y.
T. Shieh, W. J. Chen, T. H. Ho, 2011, “Synthesis and photovoltaic properties of a low
band gap donor-acceptor alternating copolymer with benzothiadiazole
unit”, Solar Energy Materials & Solar Cells, 95, 3295-3302.
S. Y. Shen,
Y. J. Wu, K. S. Ho, T. H. Hsieh, T. H.
Ho, Y. Z. Wang, P. H. Tseng, Y. C. Hsu, 2011, “Branched and curved nanotubular polyaniline
synthesized by emulsion polymerization in presence of zinc salts of n-dodecylbenzenesulfonic acid”, Polymer, 52, 2609-2617.
22. C. H, Yu, C. H. Wu, T.
H. Ho, and P. K. A. Hong, 2010, “Decolorization
of C.I. Reactive Black
23. 林益生、許蓁容、何宗漢*、伍玉真、鄧希哲, 2010, “環氧成型模料對構裝後晶片可靠度的影響”, 工程科技與教育學刊, 7(4), 532-545.
24. 劉心怡、洪雅慧、何宗漢*、伍玉真、鄧希哲, 2010, “銀膠種類及厚度對構裝後晶片可靠度的影響”, 工程科技與教育學刊, 7(4), 546-559.
25. T.H. Hsieh, T.H. Ho,
K.S. Ho, H.R. Chen, P.H. Li, S.S. Yang, S.H. Ye and Y.C. Chang, 2010, "Studies on the Cure
kinetics and Networks Properties of Neat and Polydimethylsioxane
Modified Tetrafunctional Epoxy Resins", J. Appl.
Polym. Sci., 117, 581–587.
26. R. H. Lin,
R.Y. Huang, F. S Yen, Y.H. Chen, T. H. Ho, 2010, “Kinetic Rate Equation Combining Ultraviolet-induced and
Thermal Cure I. Bismaleimide System”, J. Appl. Polym.
Sci., 115 (2), 935-947.
27.
何宗漢、林于捷、楊艾琪, 2009, “含磷難燃劑乙烯系DOPO衍生物之合成及物性研究”, 工程科技通訊, 102, 65.
28. S. S. Yang, T. H. Hsieh, Xiaotao Bi,
K. S. Ho, T. H. Ho, H. R. Chen, S.
H. Ye, and Y. C. Cang, 2009, “Dynamic Cure
Kinetics of Epoxy-Novolac Compounds by Differential
Scanning Calorimetry”, J. Appl. Polym.
Sci., 114, 2373.
29. Ko-Shan Ho, Yu-Kai Han, Yu-Tsung Tuan,
Ying-Jie Huang, Yen-ZenWang,
Tsung-Han Ho, Tar-Hwa
Hsieh Jong-Jing Lin and Su-Chi Lin, 2009, “Formation and degradation mechanism
of a novel nanofibrous polyaniline”,
Synthetic Metals 159, 1202-1209.
30. 何宗漢、曾國洲、鄭錫勳、吳修竹、梁桓祐, 2009, “軟性銅箔基板用含磷黏著劑之製備及其物性研究”, 高雄應用科技大學學報, 38, 1-19.
31. T. H. Ho, H. J. Hwang, J. Y. Shieh, M. C. Chung, 2009, “Thermal, physical and flame-retardant properties of phosphorus-containing
epoxy cured with cyanate ester”, Reactive & Functional
Polymers, 69, 176–182. SCI
32. 李玉萍、鄭錫勳、何宗漢*, 2008, “電鍍製程因素對突波吸收器鍍膜的影響”, 工程科技與教育學刊, 5(4), 629-640.
33. 何宗漢、顏福杉、鄭錫勳、王德修, 2008, “半導體封裝用低應力環氧樹脂硬化物之製備及其物性研究”, 工程科技與教育學刊, 5(4),
521-529.
34. T. H. Ho, and H. Y. Liang, 2008
“Synthesis and Characterization of
a Novel Phosphorous-Containing Flame Retardant and It’s Epoxy Networks”, Polym. Degrad. and
Stab., submitted.
35. T. H. Ho, F. S. Yen, K. S. Ho, T. H. Hsieh, R. H. Lin, A. C. Yang, 2010, “Synthesis, Characterization and
Properties of Polyphenylene Oxide-Containing Epoxy
Resin Compositions for High Frequency Substrate Application”, Eur.
Polymer J., submitted.
36. C. H, Yu, C. H. Wu, T.
H. Ho, and P. K. A. Hong, 2010, “Decolorization
of C.I. Reactive Black
37. 林益生、許蓁容、何宗漢*、伍玉真、鄧希哲, 2010, “環氧成型模料對構裝後晶片可靠度的影響”, 工程科技與教育學刊, 7(4),
532-545.
38. 劉心怡、洪雅慧、何宗漢*、伍玉真、鄧希哲, 2010, “銀膠種類及厚度對構裝後晶片可靠度的影響”, 工程科技與教育學刊, 7(4),
546-559.
39. T. H. Ho, and H. Y. Liang, 2009,
“Synthesis and Characterization of
a Novel Phosphorous-Containing Flame Retardant and It’s Epoxy Networks”, Polym. Degrad. and
Stab., submitted.
40. T. H. Ho, A. C. Yang, K. S. Ho, T. H. Hsieh, R. H. Lin, , 2009, “Synthesis, Characterization and
Properties of Polyphenylene Ether-Containing Epoxy
Resin Compositions”, Eur. Polymer J., submitted.
41. C. H, Yu, C. H. Wu, T.
H. Ho, and P. K. A. Hong, 2010, “Decolorization
of C.I. Reactive Black
42. T.H. Hsieh, T.H. Ho,
K.S. Ho, H.R. Chen, P.H. Li, S.S. Yang, S.H. Ye and Y.C. Chang, 2010, "Studies on the Cure
kinetics and Networks Properties of Neat and Polydimethylsioxane
Modified Tetrafunctional Epoxy Resins", J. Appl.
Polym. Sci., 117, 581–587.
43.
何宗漢、林于捷、楊艾琪, 2009, “含磷難燃劑乙烯系DOPO衍生物之合成及物性研究”, 工程科技通訊, 102, 65.
44. S. S. Yang, T. H. Hsieh, Xiaotao Bi,
K. S. Ho, T. H. Ho, H. R. Chen, S.
H. Ye, and Y. C. Cang, 2009, “Dynamic Cure
Kinetics of Epoxy-Novolac Compounds by Differential
Scanning Calorimetry”, J. Appl. Polym.
Sci., 114, 2373.
45. R. H. Lin, R.Y. Huang, F. S Yen, Y.H. Chen, T.
H. Ho, 2009, “Kinetic Rate Equation Combining Ultraviolet-induced and
Thermal Cure I. Bismaleimide System”, J. Appl. Polym.
Sci., 115 (2), 935-947.
46. Ko-Shan Ho, Yu-Kai Han, Yu-Tsung Tuan,
Ying-Jie Huang, Yen-ZenWang,
Tsung-Han Ho, Tar-Hwa
Hsieh Jong-Jing Lin and Su-Chi Lin, 2009, “Formation and degradation
mechanism of a novel nanofibrous polyaniline”,
Synthetic Metals 159, 1202-1209.
47. 何宗漢、曾國洲、鄭錫勳、吳修竹、梁桓祐, 2009, “軟性銅箔基板用含磷黏著劑之製備及其物性研究”, 高雄應用科技大學學報, 38, 1-19.
48. T. H. Ho, H. J. Hwang, J. Y. Shieh, M. C. Chung, 2009, “Thermal, physical and flame-retardant properties of
phosphorus-containing epoxy cured with cyanate ester”, Reactive & Functional Polymers,
69, 176–182. SCI
49. 李玉萍、鄭錫勳、何宗漢*, 2008, “電鍍製程因素對突波吸收器鍍膜的影響”, 工程科技與教育學刊, 5(4), 629-640.
50. 何宗漢、顏福杉、鄭錫勳、王德修, 2008, “半導體封裝用低應力環氧樹脂硬化物之製備及其物性研究”, 工程科技與教育學刊, 5(4), 521-529.
51. T. H. Ho, H. J. Hwang, J. Y. Shieh, M. C. Chung, 2008, “Thermal and physical properties of flame-retardant epoxy
resins containing 2-(6-oxido-6H-dibenz(c,e)(1,2)oxaphosphorin-6-yl)-
1,4-naphthalenediol and cured with dicyanate ester”, Polym. Degrad. and Stab., 93,
2077–2083.
52. 何宗漢、王德修、林烈利, 2008, “新穎芳烷基酚醛樹脂之合成及鑑定”, 工程科技與教育學刊, 5(2), 156-167.
53. T. H. Hsieh, J. K. Huang, K. S. Ho,
X. Bi, T. H. Ho, S. S. Yang and Y. C. Chang, 2008, ”Preperation
and Charateruzation of Vinylidene
Chloride-co-Vinyl Chloride Copolymer/Flourinated Synthetic Mica Nanocomposites
I Thermal and Mechanical Properties Studies”, J. Polym.
Sci. Part B: Polym. Phys., 46, 1214-1225.
54. 何宗漢、曾國洲、鄭錫勳、吳修竹、梁桓祐, 2007, “黏著劑中難燃劑含磷量對三層可撓性銅箔基板之物性影響”, 工程科技與教育學刊, 4(4), 429-438.
55. R. H. Lin, Y. H. Liu, Y. H. Chen, A.
C. Lee, and T. H. Ho, 2007, “Morphology controls of the melt blending in
a novel highly crosslinked bismaleimide
system”, Eur. Polymer J.,43, 4197-4209.
56. 何宗漢、林烈利、吳効謙、鄭錫勳, 2006, “含磷芳烷基酚醛樹脂之合成及物性研究”, 工程科技與教育學刊, 3(2), 133-149.
57. 何宗漢、李旺達、孫逸民、張福林, 2006, “環境條件對Aspergillus terreus吸附水中重金屬離子之影響”, 高雄應用科技大學學報, 35, 335-346.
58. T. H. Ho, T. S. Leu and S. S. Cheng, 2006, “Synthesis and Properties of Interpentrating Polymer Network of Modified Epoxy Resins”,
J. Appl. Polym. Sci., 101, 1872-1879. SCI, NSC
90-2626-E-151-002
59. T. H. Ho, T. S. Leu, Y. M. Sun, J. Y. Shieh,
2006, “Thermal degradation kinetics and flame retardancy
of phosphorus-containing dicyclopentadiene epoxy
resins”, Polym. Degrad. and Stab., 91, 2347-2356. SCI
60. 鄭錫勳、何宗漢、呂祖尚、林烈利, 2005, “Polysiloxane-TPU改質半導體封裝用環氧樹脂之微結構及其熱性質研究”, 工程科技與教育學刊, 2(2), 219-238.
61. 何宗漢、陳玉仙、李旺達、戴嘉賢、吳長浩, 2004, “Dicyclopentadiene型難燃環氧樹脂之合成、鑑定及熱性質探討”, 高雄應用科技大學學報, 33, 9
62. T. H. Ho and T. S. Leu,
2003 “Preparation and Characterization of Long Chain Multi-Maleimide
Containing Aralkyl Group Linkages”, J Appl Polym Sci., 90, 1066-1072. SCI, NSC
89-2214-E-151-002
63. 何宗漢、吳効謙、李旺達、吳靜玟, 2002, “含萘環氧樹脂之合成、改質及其物性研究”, 高雄應用科技大學學報, 32,
1-16. NSC 90-2626-E-151-002
64. T. H. Ho and C. S. Wang, 2001, “Modification of Epoxy Resin with Siloxane Containing Phenol Aralkyl
Epoxy Resin for Electronic Encapsulation Application”, Eur. Polymer J., 37,
267-274. SCI, NSC 88-2214-E-151-001
65. T. H. Ho, 2000, “Synthesis of Naphthalene Containing Aralkyl
Novolac Epoxy Resins for Electronic Application”, Macromol. Mater.
66. 王春山,何宗漢, 1999,“低應力半導體封裝材料之簡介”, 工程月刊, 72(11), 19-28.
67. T. H. Ho and C. S. Wang, 1999, “Synthesis of Aralkyl
Novolac Epoxy Resins and Their Modification with Polysiloxane Thermoplastic Polyurethane for Semiconductor
Encapsulation”, J. Appl. Polym. Sci., 74,
1905-1916. SCI, NSC 88-2214-E-151-001
68. 孫逸民 , 鍾美惠 , 何宗漢, 1997, “含萘脂肪族聚酯之合成與合成與性質測試”, 技術學刊, 12(2), 337-344.
69. J. Y. Shieh, T. H. Ho, and C. S. Wang, 1997, “Synthesis and Modification of Trifunctional Epoxy Resins with Polydimethylsiloxane
for Microelectronic Encapsulation”, Angew. Makromol. Chem., 245, 125-137. SCI
70. L. L. Lin, T. H. Ho,
and C. S. Wang, 1997, “Synthesis of Novel Trifunctional
Epoxy Resins and Their Modification with Polydimethylsiloxane
for Electronic Application”, Polymer,
38(8), 1997-2003. SCI
71. T. H. Ho and C. S. Wang, 1996, “Modification of Epoxy Resins with Polysiloxane TPU for Electronic Encapsulation(I)”,
Polymer, 37(13), 2733-2742. SCI, NSC 830405E006 046
72. T. H. Ho, J. H. Wang, and C. S. Wang, 1996, ”Modification of Epoxy Resins
with Polysiloxane TPU for Electronic Encapsulation
(II)”, J. Appl. Polym.
Sci., 60, 1097-1107. SCI, NSC 830405E006 046
73. J. Y. Shieh, T. H. Ho, and C. S. Wang, 1996, “Synthesis and Modification of Trifunctional Epoxy Resins with Amine-Terminated Polydimethylsiloxane for Semi-conductor Encapsulation
Application”, J. Polym.
Res., 3(2), 125-132. SCI
74. M. C. Lee, T. H. Ho,
and C. S. Wang, 1996, “Synthesis of Tetrafunctional
Epoxy Resins and Their Modification with Polydimethylsiloxane
for Electronic Application”, J. Appl. Polym. Sci., 62,
217-225. SCI
75. T. H. Ho and C. S. Wang, 1994 “Dispersed Acrylate Rubber-Modified Epoxy
Resins for Electronic Encapsulation”, J. Polym. Res., 1(1), 103-108.
76. T. H. Ho and C. S. Wang, 1994, “Modification of Epoxy Resins by Hydrosilation for Electronic Application”, J. Appl. Polym.
Sci., 54, 13-23.
77. T. H. Ho and C. S. Wang, 1994, “Low-Stress Encapsulants
by Vinylsiloxane Modification”, J. Appl. Polym. Sci., 51, 2047-2055
78. C. S. Wang, H. J. Hwang, and T. H. Ho, 1993, “Syntheses of Novel Metabromophenolic
Compounds and Its Epoxy Resin for Electronic Packaging”, Proc. Nat'l Counc. ROC(A), 17(5), 347-352.
79. T. H. Ho and C. S. Wang, 1993, “Toughening of Epoxy Resins by Modification
with Dispersed Acrylate Rubber for Electronic Packaging”, J. Appl. Polym. Sci., 50, 477-483.
80. C. S. Wang and T. H. Ho,
1992, “Meta-Bromobiphenol and Its Epoxy Resin in
Electronic Applications”, Chinese J.
Mater. Sci., 24(2), 123-132.
81. 何宗漢, 1991, “聚偏二氯乙烯初期熱脫氯化氫之動力研究”, 技術學刊, 6(1),
83-88.
82. 何宗漢, 1989, “乳化聚偏二氯乙烯之熱劣化動力研究”, 高雄工專學報, 第十九期, 169-192.
(B)研討會論文
1.
Yu-Ya Peng, Yu-Ting Hong, Yi-Sheng Lin, Shan-Hsuan
Ho, Tsung-Han Ho, Shi-Shiun
Cheng, 2018, “Preparation and thermal properties of liquid crystalline epoxy
resin with ketone mesogen composites containing
functionalized ceramic fillers”, 2018 AMPS, National Taipei University of
Technology, PII-D-66, (2018.1/12-13).
2.
Yan-Chang Liou,
Chong-Wei Li, Yung-Hsiang Chiu, Yi-Sheng Lin, Tsung-Han Ho, Shi-Shiun Cheng, 2018,
“Synthesis, characterization and thermal properties of a liquid crystalline
epoxy containing amide mesogen”, 2018 AMPS, National
Taipei University of Technology, PII-B-51, (2018.1/12-13).
3.
I-Wen Lee, Yu-Ya
Peng, Yan-Chang Liou, Shan-Hsuan Ho, Yi-Sheng Lin, Tsung-Han Ho, Shi-Shiun Chenga,
2018, “Synthesis, characterization and thermal properties of a liquid crystalline
epoxy containing Schiff base mesogen”, 2018 AMPS,
National Taipei University of Technology, PII-B-50, (2018.1/12-13).
4.
Sih-Ting Ye, Yu-Ya Peng, Jiu-Long Li, Tsung-Han Ho, Yan-Chang Liou,
Shi-Shiun Cheng , Shan-Hsusn
Ho, 2018, “Preparation and Corrosion Evaluation of Micro-arc Oxidation Coating
Formed on Aluminum Alloy Sealed with Resin Coating”, 64th TwIChE Annual Meeting, National Taipei University of
Technology, PC001,0008, (2017.11/17-18).
5.
I-Wen Lee, Sih-Ting
Ye, Yi-Sheng Lin, Yi-Shi Yang, Tsung-Han Ho,
Shi-Shiun Cheng, 2017, “Synthesis, characterization
and thermal properties of a liquid crystalline epoxy containing Schiff base mesogen”, 2017 AMPS, National Chung Hsing
University, PI-144, (2017.1/13-14).
6.
Yen-Sen Liao,
Min-Hua Chung, Chiu-Wen Lee and Tsung-Han
Ho, 2016, “Synergistic effect of thermal and mechanical properties of epoxy
composites containing mesoporous silica coated carbon
nanotubes and silica particles”, The 11th IMPACT Conference, Taipei, Taiwan, F2375, p.712-715,
(2016.10/21-23).
7.
Yi-Sheng Lin, Yu-Hsiang Hsiao, Steve
Lien-Chung Hsu and Tsung-Han Ho, 2016, “Studies on Thermal and
Mechanical Properties of Liquid Crystalline Epoxy Resin for Semiconductor
Packaging Materials”, The 11th IMPACT Conference, Taipei, Taiwan,
TW037-1F, p.461-464, (2016.10/21-23).
8.
Yu –Ting Lin, Shu-Hsien Lee, Mei-Chuan Yeh, Yu-Hsiang Hsiao, Ping-Feng Yang and Tsung-Han Ho, 2015, “In–situ Observation of Electromigration
Induced Failure Modes and Intermetallic Compound Growth Mechanisms for Chip
Scale Packages with Different Structures”, The 10th IMPACT
Conference, Taipei, Taiwan(2015.10/21-23). Outstanding Poster Paper Award
9.
Tsung Han Ho and Ming-Dar Fang, “Preparation of advanced carbon anode materials from mesocarbon microbeads for use in high C-rate Lithium Ion Battery,” International Multi-Conference on
Engineering and Technology Innovation 2015, A5013, 高雄市台灣.
10. Te Hua Fang, Chia Ling Chang, Tsung Han Ho, “Damage and surface characteristics of
human hair cuticles using nanoindentation and scanning
force microscopy”, the 2015 International Conference on Applied System
Innovation (ICASI 2015), 東京市日本.
11.
何宗漢、鄭錫勳、劉旭唐、陳妍婷、趙珅暢, “酮基團液晶環氧樹脂導熱複合材料之製備及其熱性質研究”, 2015年高分子年會, 台灣科技大學.
12.
Chialing Chang, Tsung-Han Ho, Te-Hua
Fang, 2014, “Topographical and tribological
characteristics of Asian human hair cuticles”, the 3rd International conference
on Innovation Communication and Engineering, Mathematical Problems in Engineering, No.0617, p.67, Guiyang, Guizhou Province, P.R. China (Oct.17~22, 2014).
13.
何宗漢、吳文傑、蔡坤成、楊逸士, “應用於TFT-LCD 無鹼玻璃拋光之不同發泡密度拋光墊的研究”, 2013年高分子年會, 中正大學.
14.
何宗漢, “有害廢棄物焚化底灰金屬分佈特徵分析”, 2013, 工程永續與土木防災研討會.
15. 何宗漢、鄭錫勳、鄭宇程、陳曉潔, “液晶高分子複合材之製備及其熱性質研究”, 2013,台灣化學工程學60週年年會暨國科會化學工程學門成果發表會(The 60th Annual Meeting of the Taiwan Institute of Chemical
Engineers), 論文編號E-045, p.42, 台灣科技大學(2013.11/22).
16. 何宗漢、林益生、鄭宇程、陳曉潔、陳勁宏、洪明憶, 2013, “以酮基為介晶基液晶環氧樹脂之合成、鑑定及硬化動力學研究”, 中國材料科學學會102年年會論文集, 複合材料, 論文編號 H-102, p24, 中央大學(2013.10/19).
17. 何宗漢、林益生、陳勁宏、
18.
何宗漢、鄭錫勳、
19.
何宗漢、謝正悅、郭壽儀、鄭錫勳、林益生、邱怡禎, “含磷水性PU之合成及其熱性質探討”, 2012中華民國高分子學會年會(2012 Annual Meeting of the Polymer Society, Taipei), 論文編號 PB1-2, p.138, 中原大學(2012.01/16)
20.
何宗漢、鄭錫勳、
21.
林獻能、黃信淵、楊佳霓、顏福衫、何宗漢, “含磷壓克力樹脂之合成鑑定與熱安定性分析”, 2011中華民國高分子學會年會(2011 Annual Meeting of the Polymer Society, Taipei), 論文編號 FP-098, p.226, 逢甲大學(2011.1/21)
22.
劉有恭、林獻能、何宗漢、顏福衫, “填料中之水分對聚氨酯推進劑阻燃層機械性質之影響”, 2011中華民國高分子學會年會(2011 Annual Meeting of the Polymer Society, Taipei), 論文編號 FP-0103, p.227, 逢甲大學(2011.1/21)
23.
Sheng-Yang Peng, Tsung-Han Ho, 2011, “Methodology to screen, optimize process key factors of
solder sealing for hermetic MEMS package”, 2011 Electronic Technology Symposium
(ETS) at Kaohsiung, Session 14, DO-11, (2011.06/10) Outstanding Poster Paper Award
24.
伍俊任、劉守恒、何宗漢、許瀚仁、陳世哲、謝文浩, “製備氮摻雜中孔二氧化鈦材料”, 2010年奈米技術與材料研討會(Nanometer-Scale Technology and Materials Symposium 2010), 論文編號 P16, p.40, 大葉大學(2010.12/17)
25.
伍俊任、劉守恒、何宗漢、許瀚仁、陳世哲、謝文浩, “負載非貴重鐵金屬於氮摻雜中孔碳材及其應用於氧氣還原反應之研究”, 第五屆全國氫能與燃料電池學術研討會,論文編號 FF1-016, p.37, 成功大學 (2010.12/17~12/18)
26.
何宗漢、鄭錫勳、李科諒、李安成、吳宇明、顏禎志, 2010, “由廢偏光板回收TAC之物性分析”, 中國化學會2010年年會, 論文編號 GR021,
p.185, 台灣大學(2010.12/03~12/05)
27.
何宗漢、謝正悅、林嘉賢、李科諒、洪雅慧、劉心怡, 2010, “水性聚胺基甲酸酯黏著劑之合成及物性之研究”, 九十九年中國材料科學學會年會, 論文編號 01-0127, p.P-7, 義守大學(2010.11/19~11/20)
28.
何宗漢、呂祖尚、曾耀霆、許蓁容、林益生,2010, “不同側鏈氧氮苯并環己烷奈米複合材合成與物性之研究”, 九十九年中國材料科學學會年會, 論文編號 10-0089, p.P-282, 義守大學(2010.11/19~11/20) 榮獲複合材料組佳作
29.
李錚鴻、林律甫、何宗漢、鄭錫勳, 2010, “The control way of solder blister as plating machine
breakdown”, IMPACT Conference 2010, Internation 3D IC
Conference, 論文編號 Tw027-02, p.46, 台北南港展覽館(2010.10/20~10/22)
30.
李錚鴻、林律甫、何宗漢、鄭錫勳, 2010, “The control way of solder blister as plating machine
breakdown”, IMPACT Conference 2010, Internation 3D IC
Conference, 論文編號 Tw027-01, p.46, 台北南港展覽館(2010.10/20~10/22)
31.
何宗漢、呂祖尚、曾耀霆、許蓁容、林益生, 2010, “氧氮苯并環己烷奈米複材之合成、鑑定及其熱硬化動力研究”, 中國化學會2010年年會, 論文編號 31, p.143, 嘉南藥理科技大學(2010.5/29)
32.
何宗漢、謝正悅、林嘉賢、洪雅慧、劉心怡,2010, “利用不同軟硬段比及離子基含量合成水性PU之探討”, 中國化學會2010年年會, 論文編號 22, p.134, 嘉南藥理科技大學(2010.5/29)
33.
何宗漢、蔡技靜、吳良蟬,2010, “茶多酚殺菌劑之製備及應用”, 中國化學會2010年年會, 論文編號 08, p.120, 嘉南藥理科技大學(2010.5/29)
34.
Wu, C. H., Ho, T.H., and Kuo, C. Y., 2010, “Decolorization of Textile Wastewater by UV/Oxidant
Systems”, The 1st IWA
35.
何宗漢、謝正悅、鄭錫勳、林嘉賢、曾耀霆,2010, “利用不同離子基含量合成水性PU之探討”, 99高分子年會學會, BP-006, p.191, 高雄大學(2010.1/22-1/23)
36.
何宗漢、呂祖尚、鄭錫勳、曾耀霆、林嘉賢,2010, “New Method for
Kinetic Parameter Estimation by Dynamic Experiment of Benzoxazine
System”, 99高分子年會學會, BP-007, p.192, 高雄大學(2010.1/22-1/23) 榮獲高分子組佳作論文獎
37.
林錦讚、何宗漢,2009, “新穎含磷難燃劑之合成鑑定及其對熱固性樹脂硬化行為之探討”,第二屆兩岸三地綠色材料學術研討會, P24, p.37, 國立高雄應用科技大學(2009.7/14~7/15)
38.
楊艾琪、何宗漢、陳詩婷、蔡欣潔、吳怡萱, 2009, “Preparation and properties of
PPO-based Epoxy Resins”, 第二屆兩岸三地綠色材料學術研討會, P24, p.37, 國立高雄應用科技大學 (2009.7/14~7/15)
39.
蔡欣潔、何宗漢、鄭錫勳、楊艾琪、吳怡萱、姜睿緒, 2009, “Preparation and physical properties of epoxy micro/nano composite”, 第二屆兩岸三地綠色材料學術研討會, P25, p.38, 國立高雄應用科技大學 (2009.7/14~7/15)
40.
吳怡萱、何宗漢、林正輝、呂祖尚、李家豪, 2009, “Simultaneously and rapidly
determine bleaching agents in cosmetics by high-performance liquid
chromatography with gradient elution”, 第二屆兩岸三地綠色材料學術研討會, P26, p.39, 國立高雄應用科技大學(2009.7/14~7/15)
41.
伍玉真、何宗漢, 2009, “符合綠色環保之半導體構裝材料及其可靠度分析”, 第二屆兩岸三地綠色材料學術研討會, P31, p.44, 國立高雄應用科技大學 (2009.7/14~7/15)
42.
何宗漢、鄭錫勳、蔡欣潔、楊艾琪, 2009, “奈米碳管/銀膠複合材料之製備及其特性之研究”, 98高分子學會年會, FP-122, p.357, 大同大學(2009.1/9-1/10)
43. 何宗漢、呂祖尚、楊艾琪、蔡欣潔, 2009, “Preparation of PPO-based epoxy
resins and their curing behavior”, 98高分子學會年會, AP-064, p.202, 大同大學(2009.1/9-1/10)
44. 楊艾琪、何宗漢, 2008, “聚苯醚的合成、改質及其熱性質研究”, 97年中國化學會年會, 論文編號 OC081, p.174, 國立彰化師範大學(2008.12/5-12/7)
45. 吳怡萱、何宗漢、林正輝、呂祖尚、賴昱伶、陳雅萍, 2008, “Simultaneously
and rapidly determine bleaching agents in cosmetics by high-performance liquid chromatography
with gradient elution”, 97年中國化學會年會, 論文編號 AC031, p.147, 國立彰化師範大學(2008.12/5-12/7)
46. 何宗漢、陳星豪, 2008, “封模材料於半導體構裝體散熱片產品之裂縫現象改善”, 2008年中國材料科學學會年會暨學會四十週年慶, 論文編號 P03-063, p.100, 國立臺北科技大學(2008.11/21-11/22)
47. 何宗漢、楊艾琪、黃靖文、莊為傑、賴昱伶, 2008, “新型低介電常數具末端環氧基之低分子量熱固性聚苯醚樹脂研究”, 2008年中國材料科學學會年會暨學會四十週年慶, 論文編號 P03-048, p.96, 國立臺北科技大學(2008.11/21-11/22)
48. 鄭錫勳、何宗漢、王誼任、黃靖文、陳玟錚, 2008, “含聚苯醚氰酸酯樹脂合成與鑑定及其物性之研究”, 2008年中國材料科學學會年會暨學會四十週年慶, 論文編號 P03-040, p.94, 國立臺北科技大學(2008.11/21-11/22)
49. 何宗漢、梁桓祐、陳振華、黃靖文、賴昱伶, 2008, “新穎含磷難燃劑之合成與鑑定及其環氧固化物之物性研究”, 2008年中國材料科學學會年會暨學會四十週年慶, 論文編號 P03-027, p.90, 國立臺北科技大學(2008.11/21-11/22)
50. 何宗漢、鄭錫勳、王誼任、莊為傑、莊瑞敏, 2008, “低分子量聚苯醚及其氰酸酯之製備和物性與硬化動力研究”, 2008中華民國高分子學會年會暨奈米高分子材料國際研討會, 論文編號CP-066, p.212, 國立交通大學(2008.1/18-1/19)
51. 何宗漢、梁桓祐、陳振華、楊馥懌、黃靖文, 2008, “新穎添加型含磷難燃劑之合成與難燃特性研究”, 2008中華民國高分子學會年會暨奈米高分子材料國際研討會, 論文編號AP-060, p.154, 國立交通大學(2008.1/18-1/19)
52. 何宗漢、鄭錫勳、王誼任, 2007,
“Preparation and Properties of Low Molecular Weight Polyphenylene
Ether Resins and Their Derivatives for Electronic Application” 96年中國化學年會(第11屆台北國際化學會議), 論文編號MC0092, p.C-220, 國立清華大學(2007.12/14-12/16)
53. 何宗漢, 梁桓祐、陳振華, 2007, “Synthesis of a novel phosphorous-containing additive flame retardant and
properties of cured products”, 96年中國化學年會(第11屆台北國際化學會議), 論文編號MC0095, p.C-221, 國立清華大學(2007.12/14-12/16)
54. 鄭錫勳、何宗漢、王誼任、莊瑞敏、楊馥懌, 2007, “低分子量聚苯醚及其氰酸酯之製備與鑑定”, 中國材料科學學會2007年年會論文摘要集, 11月16-17日, 新竹 交通大學, 論文編號:P03-082, p.143。
55. 何宗漢、梁桓祐、陳振華、楊茗琍、張婉婷, 2007, “新穎添加型含磷難燃劑合成與鑑定”, 中國材料科學學會2007年年會論文摘要集, 11月16-17日, 新竹 交通大學, 論文編號:P03-073, p.139。
56. 何宗漢、鄭錫勳、蔡瑞哲、林烈利、顏福杉, 2007, ”含矽熱固性聚苯醚樹脂之製備及其熱機械性質研究”, 2007年中國材料科學學會年會, 11月16-17日, 新竹 交通大學, 論文編號:P03-087, p.146。
57. 何宗漢、鄭錫勳、蔡瑞哲、林烈利、林榮顯, 2007, “低介電熱固性聚苯醚樹脂之製備及熱穩定性研究”, 2007年中國材料科學學會年會, 11月16-17日, 新竹 交通大學, 論文編號:P03-088, p.146。
58. 何宗漢、 鄭錫勳、蔡瑞哲、吳慶安、胡峻瑋, 2007,“熱固性聚苯醚樹脂之製備及熱穩定性之研究”, 2007年化學年會高雄分會研討會,
59. Tsu-Shang Leu, Tsung-Han Ho, Guan-Ming Chen, Yan-Heng Liao,
2007, “Thermal degradation kinetics and
flame retardancy ofPhosphorus-Containing
Dicyclopentadiene Epoxy Resins”, 2007年高分子研討會,
60. 何宗漢、 鄭錫勳、蔡瑞哲、陳松齡, 2007. “熱固性聚苯醚樹脂之製備和物性及其在高頻基板之應用”, 2007年高分子研討會,
61. 何宗漢、鄭錫勳、林于捷、林坤壕、吳怡萱, 2006, “含磷難燃劑DOPO-GMA之合成及物性研究”, 2006化學工程學會年會
62. T. H. Ho, et. al., 2006, “New Analytic Method for Kinetic Parameters
Estimation of Epoxy Resin”, 2006中華民國化學會年會,
63. 何宗漢、鄭錫勳、蔡瑞哲、吳慶安、胡峻瑋, 2006, “熱固性聚苯醚樹脂之製備和物性及其在高頻基板之應用”, 2006中華民國化學會年會,
64. 何宗漢、鄭錫勳、林于捷、林坤壕、吳怡萱、柯淑旻, 2006, “含磷難燃劑乙烯系DOPO衍生物之合成及物性研究”, 2006高雄化學會年會.
65. 何宗漢、謝正悅、鍾明智, 2006, “含磷環氧樹脂與氰酸脂組成物之合成及物性研究”, 2006高雄化學會年會.
66. 謝正悅、黃漢章、何宗漢、楊士朋、王春山, 2006, “Novel low dielectric cyanate esters”, Proceedings of the 29th ROC Polymer
Symposium.
67. 何宗漢、張勝隆、呂祖尚, 2006, “經ALDER-ENE反應之雙馬來醯亞胺樹脂於結構、性質與阻燃效應上的研究”, Proceedings of the 29th ROC
Polymer Symposium.
68. 何宗漢、謝正悅、鍾明智, 2006, “含磷環氧樹脂-氫酸脂固化物之物性研究”, Proceedings of the 29th ROC Polymer
Symposium.
69. 何宗漢、謝正悅、鍾明智, 2005, “含磷環氧樹脂-氫酸脂固化物之物性研究”, 2005中華民國化學會年會.
70. 李旺達、何宗漢、孫逸民、張福林, 2005, “以真菌Aspergillus terreus吸附水中重金屬離子及恆溫吸附模式之研究”, 5th KUAS Symp,化工與化工材料, pp.279-283.
71. 何宗漢、吳効謙、柯淑閔、林坤壕, 2005, “含磷芳烷基氰酸酯之合成及物性研究”, 5th KUAS Symp,化工與化工材料, pp.284-28756.
72. 何宗漢、鄭錫勳、林于捷、楊正妮、蔡欣潔, 2005, “乙烯系DOPO衍生物之合成及物性研究”, 2005中華民國化學會年會.
73. 李旺達、何宗漢、孫逸民、張福林, 2005, “以真菌Aspergillus terreus吸附水中重金屬離子之研究”, 第十屆生化工程研討會, 1-E-058.
74. 呂祖尚、王春山、何宗漢、張勝隆, 2005, “Studies
on Hardener Containing Phosphorus and Cyanate Ester
Groups for Flame Retardant Epoxy Resin”,
Proceedings of the 28th ROC Polymer Symposium.
75. 何宗漢、吳効謙、邱俊瑋、江棋樺、楊正妮, 2005, “含磷芳烷基酚醛樹脂之合成及物性研究”, Proceedings of the 28th ROC Polymer Symposium.
76. 何宗漢、呂祖尚、吳効謙、林于捷、蔡欣潔, 2005, “改質環氧樹脂作為BT樹脂之共硬化劑研究”, Proceedings of the 28th ROC Polymer Symposium.
77. 何宗漢、呂祖尚、陳玉仙、吳効謙、鄭錫勳, 2005, “新穎高性能雙馬來醯亞胺-氰酸酯-環氧樹脂組成物及其在印刷電路板和封裝材之應用”, Proceedings of the 28th ROC Polymer Symposium.
78. T. H. Ho, Y. H. Chen, C. H. Chiang, C. W. Chiu, and H. C. Wu, 2004, ”Synthesis
and Properties of Co-Curing Agent and Its Effect on Thermal Properties of BT
Resin Systems”,The 2004 Annual Conference of The Chinese
Society for Material Science,電子及微機電構裝與材料.
79. 何宗漢、吳效謙、邱俊瑋、江棋樺, 2004, “電子用新穎含磷難燃劑之合成及物性研究”, 2004中華民國化學會年會.
80. T. H. Ho, Y. H. Chen, C. H. Chiang, C. W. Chiu, and H. C. Wu, 2004,
”Synthesis and Properties of Co-Curing Agent and Its Effect on Thermal
Properties of BT Resin Systems”,The 2004 Annual
Conference of The Chinese Society for Material Science,電子及微機電構裝與材料.
81. T. S. Leu and T. H. Ho, 2004, “Water
Diffusion Behaviors of Polyimide Films Containing Naphthalene Unit”, Proceedings of the 27th ROC Polymer Symposium.
82. T. S. Leu, C. S. Wang and T. H.
Ho, 2004, “Synthesis and
properties of copolyimides containing naphthalene group”,
Proceedings of the 2004 ROC Material Symposium.
83. T. S. Leu, C. S. Wang and T. H.
Ho, 2004, “Synthesis and
properties of copolyimides containing naphthalene
group”, Proceedings of the 2004 ROC Material Symposium.
84. 何宗漢、李旺達、陳志豪、侯曦均、李勝雄, 2004,“含磷難燃環氧樹脂之合成、改質及熱硬化動力研究”, 4th KUAS Symp,化工與化工材料, pp.79-83.
85. 何宗漢、鄭錫勳、陳玉仙、李玟錦、姜怡君, 2004,“BT樹脂共硬化劑之合成及其在印刷電路板之應用”, 4th KUAS Symp,化工與化工材料, pp.50-55.
86. 何宗漢、吳効謙、邱俊瑋、江棋樺, 2004,“矽酮橡膠改質環氧樹脂之微結構及熱硬化動力研究”, 4th KUAS Symp,化工與化工材料, pp.20-24.
87. 何宗漢、呂祖尚、曾怡潔、葉秋豔、陳威廷、陳昱含, 2004,“新穎感光性聚醯亞胺之合成和物性研究及其在半導體製程之應用”, 27th ROC Polym. Symp.,光電高分子材料.
88. 何宗漢、陳玉仙, 2004,“共硬化劑之合成及其對BT樹脂組成物之影響”, 27th ROC Polym. Symp.,光電高分子材料.
89. 呂祖尚、何宗漢、戴嘉賢、吳長浩, 2003, ”Synthesis and
Characterization of Copolyimides with High Solubility”, The 2003 Annual
Conference of The Chinese Society for Material Science,高分子及有機材料, PF-024, P114
90. 何宗漢、吳効謙、劉育伶、潘怡君, 2003, ”TPU-Siloxane改質半導體封裝用環氧樹脂之熱硬化動力研究”,The 2003 Annual
Conference of The Chinese Society for Material Science,電子及微機電構裝與材料, PM-021, P271
91. 何宗漢、呂祖尚、李旺達、廖思芳、彭信碩, 2003, ”Dicyclopentadiene型難燃環氧樹脂之合成、改質及熱性質探討”, The 2003 Annual
Conference of The Chinese Society for Material Science,高分子及有機材料, PF-011, P110
92. T. S. Leu, C. S. Wang, T. H. Ho, Y. H. Chen, 2003, “Kinetic
Models for Solution Imidization of Poly(amic acid) Containing Naphthalene Pendant Group”, Proceedings
of the 26th ROC Polymer Symposium, 功能性高分子, P42
93. 何宗漢、吳効謙、李旺達、呂祖尚, 2003,“電子用含萘環氧樹脂之合成及特性”, 26th ROC Polym. Symp,電子及通訊用高分子, AP-1-23. KUAS-91-CH-004
94. 何宗漢、吳効謙、李旺達, 2003,“電子用含萘環氧樹脂之合成及特性”, 3th KUAS Symp,高分子材料.
95. T. H. Hsienh, K. S. Ho, Y. C. Cang, T. H. Ho,
C. H. Hung and H. C. Tem, 2003, “Studies on Cure Behavior of Neat and Polydimethylsiloxane Modified Tetrafunctional
Epoxy Resins for Electronic Application.II”, 3th KUAS
Symp.,高分子材料.
96. 何宗漢、吳効謙、李旺達, 2002, “半導體封裝用含萘環氧樹脂之合成、改質及熱硬化動力研究”, Proceedings of the 2002 CICHE Annual Meeting and
Conferences, 大專生專題壁報比賽. KUAS-91-CH-004
97. 何宗漢、吳建誼、鄭維倫, 2001,“聚芳烷基馬來醯亞胺之合成鑑定與機械性質研究”, 材料科學學會2001年年會論文集,半導體及封裝材料, H09-08, P.212. NSC89-2214-E-151-002.17.
吳建誼、鄭維倫、何宗漢, 2002,“二異氰酸酯改質半導體封裝用含萘環氧樹脂之熱機械性質研究”, 25th ROC Polym. Symp.,功能性高分子材料, EPH-2-15, P.183.
98. 何宗漢、王宗櫚、謝美玲, 2001,“聚芳烷基馬來醯亞胺之合成及物性研究”, 24th ROC Polym. Symp.,高性能高分子材料, PH-12, P816-817. NSC89-2214-E-151-002
99. 王宗櫚、何宗漢、呂文智、李詩詮, 2001, “以原子轉移自由基聚合法合成雙段式共聚合體之研究”, 24th ROC Polym. Symp.,
PG-15, P781-782.
100. 李旺達、何宗漢、孫逸民、張福林, 2005, “以真菌Aspergillus terreus吸附水中重金屬離子及恆溫吸附模式之研究”, 5th KUAS Symp,化工與化工材料, pp.279-283.
101. 何宗漢、吳效謙、羅正雄、趙詩韻, 2000, “半導體封裝用芳烷基酚醛樹脂之合成及物性研究”,中國材料科學學會89年年會論文集,半導體及封裝材料, H88, P1- 4.
102. 何宗漢、謝美玲、蔡正偉、黃芳榮, 2000, “電子用含萘芳烷基酚醛環氧樹脂中國材料科學學會89年年會論文集,半導體及封裝材料, H89, P1- 4.
103. T. H. Ho and C. S. Wang, 2000, “Synthesis of Naphthalene Containing Aralkyl Novolac Epoxy Resins for
Electronic Application”, 23th ROC Polym. Symp., 光電用高分子材料, 214-215.
104. T. H. Ho, Y. M. Sun, and J. Y. Shieh, 2000,
“Synthesis of Aralkyl Novolac
Epoxy Resins and Their Modification with Polysiloxane
TPU for Electronic Encapsulation”, 15th T. V. E Conf. of ROC, 91-102.
105. T. H. Ho, D. Wu, and C. Y. Wu, 1999, “Synthesis of Aralkyl
Novolac Epoxy Resins and Their Modification with Polysiloxane TPU for Semiconductor Encapsulation”,
Proceedings of the 1999 CICHE Annual Meeting and Conferences, 112-116.
106. T. H. Ho, L. L. Lin, D. Wu, and C. Y. Wu, 1999, “Modification of Epoxy
Resin with Siloxane Containing Phenol Aralkyl Epoxy Resin for Electronic Encapsulation
Application”, 14th T. V. E Conf. of ROC, 375-376.
107. T. H. Ho, T. H. Hsieh, and C. S. Wang, 1999, “Synthesis of Siloxane Containing Phenol Aralkyl
Epoxy Resin for Electronic Encapsulation Application”, 22th ROC Polym. Symp., 光電用高分子材料, 375-376.
108. T. H. Ho, M. C. Lee, and C. S. Wang, 1999, “Synthesis and Modification
of Aralkyl Novolac Epoxy
Resins for Semiconductor Encapsulation”, 22th ROC Polym.
Symp.,
光電用高分子材料, 373-374.
109. M. C. Lee, T. H. Ho, and C. S. Wang, 1998, “Synthesis and
Modification of a Novel Naphthalene Containing Epoxy Resin for Electronic
Applications”, 21th ROC Polym. Symp., 高分子電子材料, 125-128.
110. T. H. Ho, J. Y. Shieh, and C. L. Chen, 1997,
“Modification of Epoxy Resins with Polysiloxane TPU
for Electronic Encapsulation(II)”, 12th T. V. E Conf. of ROC, 171-180.
830405E006 046
111. T. H. Ho, C. L. Chen, and C. S. Wang, 1996, “Modification of Epoxy
Resins with Polysiloxane TPU for Electronic
Encapsulation(I)”, 11th T. V. E Conf. of ROC, 15-24. 830405E006 046
112. T. H. Ho and C. S. Wang, 1995, “Modification of Epoxy Resins with Polysiloxane TPU for Electronic Application”, 18th ROC Polym. Symp., 1-4. 830405E006 046
113. C. S. Wang and T. H. Ho,
1995, “Polysiloxane TPU Modified Epoxy Resins for
Electronic Application”,
ACS Meetings, Div. of PMSE,
114. C. S. Wang and T. H. Ho,
“Modification of Epoxy Resins with Polysiloxane TPU
for Electronic Application”, IUPAC Int'l. Symp.
Taipei, Taiwan, 5-E-14-IL, 383-384 (1994).
115. C. S. Wang, L. L. Lin, and T.
H. Ho, “Toughening Multifunctional Epoxy Resins with Siloxane
Rubber”, Proc. of 1994 Annual Conf. of
The Chinese Soc. for Mat. Sci., 46-46 (1994).
116. J. Y. Shieh, T. H. Ho, and C. S. Wang, “Amino-siloxane
Modified Epoxy Resins for Electronic Application”, Proc. of The 1994 Annual Conf.
of The Chinese Soc. for Mat. Sci., 34-35(1994).
117. C. S. Wang and T. H. Ho, “Toughening of Epoxy Resins
by Modification with Dispersed Acrylate Rubber for Electronic Packaging”, Asian
Pacific Conference of Chemical Engineers, Melbourne, Australia 9/26-9/29, Offical Proceedings Vol.3, 287-292(1993).
118. T. H. Ho and C. S. Wang, “Morphology and Dynamic Mechanical Properties
of Rubber-Modified Epoxy Resins and Their Electronic Encapsulation
Application”, 9th T. V. E Conf. of ROC, 43-52 (1994).
119. C. S. Wang and T. H. Ho,
“Toughening of Epoxy Resins for Miroelectronic
Encapsulation”, 16th ROC Polym. Symp., 1-4(1993).
120. C. S. Wang and T. H. Ho,
“Toughening of Epoxy Resins for Miroelectronic
Encapsulation”, 16th ROC Polym. Symp., 1-4(1993).
121. T. H. Ho and C. S. Wang, “Synthesis of Novel Metabromophenolic
Compounds and Its Epoxy Resins for Electronic Packaging”, 8th T. V. E. Conf. of
ROC, 307-316 (1993).
122. T. H. Ho and C. S. Wang, “Low-Stress Encapsulants
by Vinylsiloxane Modification”, 16th ROC Polym. Symp., 337-340 (1993).
123. C. S. Wang and T. H. Ho, “Toughening of Epoxy Resin
for Miroelectronic Encapsulation”, 16th ROC Polym. Symp., 477-480 (1993).
124. C. S. Wang and T. H. Ho, “Meta-Bromobiphenol
and Its Epoxy Resin in Electronic Applications”, Proc. of The
1992 Annul Conf. of The Chinese Soc. for Mat. Sci., 436-437 (1992).
125. C. S. Wang and T. H. Ho,
“Meta-Bromobiphenol and Its Epoxy Resin in Electronic
Applications”, Proc. of 3rd. Intl. Conf. on High Techno.,
Chiba, Japan, 63-68 (1992).
126. 何宗漢, “分散的壓克力橡膠韌化電子用環氧樹脂之研究”, 15th ROC Polym. Symp.,
1013-1016 (1991).
127. 何宗漢, “聚苯硫醚之熱劣化動力研究”, 13th ROC Polym. Symp.,
714-717 (1990).
128. 何宗漢, “乳化聚偏二氯乙烯之熱劣化動力研究II.環境氣體的影響”, 13th ROC Polym. Symp., 710-713 (1990).
129. 何宗漢, “聚偏二氯乙烯初期熱脫氯化氫之動力研究”, 5th T. V. E. Conf. of ROC 1099-1103 (1990)
(C)專書、技術報告等
01. T. H. Ho and C. S. Wang, 1995, “Modification of Epoxy Resins with Polysiloxane TPU for Electronic Encapsulation”, in Microelectronics Technology Polymers for
Advanced Imaging and Packaging, E. Reichmanis, C.
K. Ober, S. A. MacDonald, T. Iwayanagi,
and T. Nishikubo Eds., ACS Symp.
Ser., 614, Chapter 35, 527-542.
NSC830405E006 046
(D)專利
目前仍有效之專利。「類別」代碼:(A)發明專利(B)新型專利。
類別 |
專利名稱 |
國別 |
專利號碼 |
發明人 |
專利權人 |
專利期間 |
國科會計畫編號 |
A |
Modification of Epoxy Resins with
Urethane Prepolymer for Electronic Encapsulation. |
美國 |
5,686,541 |
王春山何宗漢 |
國科會 |
|
830405E006046 |
A |
以胺基酸脂預聚合物改質的環氧樹脂及其 製備方法 製備方法 |
中華民國 |
090263 |
王春山何宗漢 |
國科會 |
|
830405E006046 |
A |
含磷基團化合物及其在阻燃上的應用 |
中華民國 |
公開 200811117 |
何宗漢 陳振華 |
奇盟實業股份有限公司 |
|
|
(E)計畫目錄
計畫名稱 (計畫編號) |
補助或 委託機構 |
起迄 年月日 |
計畫內 擔任之工作 |
經費 總額 |
備註 |
自廢偏光板回收三醋酸纖維素(TAC)之水解及改質研究(NSC 99-2622-E-151-002-CC3) |
國科會/ 介慶 |
|
主持人 |
712,740 |
|
回收產品(PET、PVA、TAC)純度測試與TAC水解可行性評估 |
介慶股份有限公司 |
|
主持人 |
160,000 |
|
各類PE及PP發泡產品之調配與研發 |
吉霖股份有限公司 |
|
主持人 |
150,000 |
|
以溶膠凝膠法製備奈米鈦酸鹽及其在PTC熱敏電阻器 |
教育部/ 興勤電子 |
|
共同主持人 |
800,000 |
教育部 園區計畫 |
茶多酚萃取製程改善 ( |
有澤化學股份有限公司 |
|
主持人 |
700,000 |
SBIR 轉委託案 |
絕緣導熱PI薄膜之施工及量測工作( |
律勝科技股份有限公司 |
|
主持人 |
800,000 |
國科會補助科學園區轉委託案 |
導熱型軟性印刷電路板之研究開發 |
律勝科技股份有限公司 |
|
總主持人 |
2,000,000 |
國科會補助科學園區轉委託案 |
含磷難燃劑之合成及物性研究(NSC96-2622-E-151-002-CC3) |
國科會/ 豪元實業 |
|
主持人 |
548,000 |
|
含矽熱固性聚苯醚樹脂之製備和物性研究及其在高頻基板之應用(NSC 95-2622-E-151-001-CC3) |
行政院國家科學委員會 |
|
主持人 |
527,000 |
|
電子用新穎含磷難燃劑之合成及物性研究(公-08-工-001) |
教育部/ 豪元實業 |
|
主持人 |
473,050 |
|
新穎阻燃劑使用在交聯與混攙物上之特性的研究(NSC 93-2216-E-132-001- ) |
行政院國家科學委員會 |
|
共同主持人 |
657,800 |
|
新穎高性能雙馬來醯亞胺-氰酸酯-環氧樹脂組成物及其在印刷電路板和封裝材之應用(NSC 92-2216-E-151-001- ) |
行政院國家科學委員會 |
|
主持人 |
694,500 |
|
矽酮橡膠改質環氧樹脂之微結構及熱硬化動力研究(KUAS-92-CH-007 ) |
國立高雄應用科大 |
|
主持人 |
48,000 |
|
新穎感光性聚醯亞胺之合成和物性研究及其在半導體製程之應用(NSC 91-2216-E-151-002- ) |
行政院國家科學委員會 |
|
主持人 |
587,600 |
|
含萘多官能環氧樹脂之改質及物性研究(KUAS-91-CH-004 ) |
國立高雄應用科大 |
|
主持人 |
96,000 |
|
電路板用新穎含萘多官能環氧樹脂之合成及物性研究(NSC 90-2626-E-151-002- ) |
行政院國家科學委員會 |
|
主持人 |
460,000 |
|
微電子元件之封裝材─液態環烷系環氧樹脂及其內涵熱觸媒之研究(NSC 89-2218-E-151-008- ) |
行政院國家科學委員會 |
|
共同主持人 |
496,000 |
|
電子構裝用新穎多官能環氧樹脂(III)(NSC 89-2214-E-151-002) |
行政院國家科學委員會 |
|
主持人 |
584,000 |
|
電子構裝用新穎多官能環氧樹脂(II) (NSC 88-2214-E-151-001) |
行政院國家科學委員會 |
|
主持人 |
559,600 |
|
電子構裝用新穎多官能環氧樹脂(I) (NSC 87-2214-E-151-002) |
行政院國家科學委員會 |
|
主持人 |
424,000 |
|
半導體封裝用新穎多官能環氧樹脂 (NKIT 86-CH-004) |
國立高雄科技學院 |
|
主持人 |
100,000 |
|